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Wire Bonder with Bump Capability

Posted on: December 20, 2021 | Back | Print

Tender Ref. No: 207/HCP-0034/IRDF/10-Pur/2021

Published date: 16-Dec-2021 04:00 PM

Bid Submission End Date: 18-Jan-2022 02:30 PM

Bid Opening Date: 19-Jan-2022 03:30 PM

Tender Inviting Authority: Stores & Purchase Officer to CSIR-CEERI, Pilani - 333031 Rajastan

Website: CPP Portal www.etenders.gov.in, Tender ID No. 2021_CSIR_98540_1.